Radian Thermal Products

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Product Listing

Environment Protect

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Machined custom heatsink

* A machined custom heatsink uses Radian's highly versatile machining capabilities.

* With low set-up costs, and machined custom heatsinks are ideal for low to medium volumes.

Custom Heatsink

Plate Fin Heatsink

Round Pin Heatsink

Fansink

PCIE Heatsink

EZ Snap Clip

Vapor Chamber Heatsink

PCIE Fansink

Z clip with Pins

Heatsink Captive Screws

Machined custom heatsink

* Aluminum Extrusions have conventionally been the predominant approach for low cost custom heatsink production. 

* Radian uses high thermal conductivity aluminum alloy A6063 200 W/(m-K) which most heatsink manufacturers do not use as it is "gummy" and difficult to work without without a good process recipe.

* A Extruded heatsink is suitable for high volume production as it has a relatively low NRE.

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Forged custom heatsink

* A Forged custom heatsink can be manufactured using special open die tooling and intense pressure to form thin-sectioned, high precision heatsinks. 

* High aspect ratios can be achieved using Precision Forging.

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Die-Cast Custom heatsink

* Aluminum offers a cost effective Die-Cast custom heatsink solutions for medium, to large production volumes. 

* Radian uses Thermocast which is a proprietary technology to die-cast a high thermal conductivity Aluminum alloy with a thermal conductivity 0f ~160 W/m-k.

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Skived custom heatsink

* A Skived custom heatsink combines special cutting tools and a controlled shaving technique to produce a heatsink from a single block of material, such as copper or aluminum.

* The typical result is a thin-finned heatsink, with a dense population of uniformly shaped and distributed fins.

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Round Pin Heatsink

* A Round Pin Heatsink was developed for low air flow environments. The round shaped pins are set in a pattern that makes it easier for air to efficiently flow through the heat sink.

* Designed specifically for BGAs and other surface mount packages

* Optional EZ-SnapTM mounting clip is constructed of UL94-V0 rated nylon

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Plate Fin Heatsink

* A Plate Fin Heatsink extracts heat by convection, and uses straight fins that run the entire length to maximize the surface area of the heatsink.

* The large fins create heat spreading so that more energy can be removed at the same temperature difference.

* A variation of the straight fin heat sink is a cross cut heat sink where the straight fin heat sink is cut at regular intervals.

* Plate fin Heatsinks can be manufactured in various ways such as machined, extruded, cast, stamped, folded, or skived. 

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Plate Fin Heatsink

* A Plate Fin Heatsink extracts heat by convection, and uses straight fins that run the entire length to maximize the surface area of the heatsink.

* The large fins create heat spreading so that more energy can be removed at the same temperature difference.

* A variation of the straight fin heat sink is a cross cut heat sink where the straight fin heat sink is cut at regular intervals.

* Plate fin Heatsinks can be manufactured in various ways such as machined, extruded, cast, stamped, folded, or skived. 

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Vapor Chamber Heatsink

* Constructed from sealed copper plates, and filled with a small amount of fluid such as de-ionized water that allows heat to be rapidly dispersed away from the source.

* Classed formally as a heatpipe, a Vapor chamber is one of the best heat spreading option at the base of a heatsink, and is typically used for high power devices.

* A vapor chamber is typically combined with stamped fins to create a high-end thermal management device that can rapidly spread heat from a small source to a large area.

* It can be integrated with either aluminum or copper heatsinks.

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PCIe Heatsink

* A PCIe heatsink is specifically designed for a PCI Express (Peripheral Component Interconnect Express) card, which is a high-speed serial computer expansion bus standard

* Format specifications are maintained and developed by the PCI-SIG (PCI Special Interest Group), a group of more than 900 companies that also maintain the conventional PCI specifications. 

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EZ Snap Clip

* EZ Snap Mounting Clips are design specifically for processors and ball grid array (BGA) components..

* EZ Snap™ clips require no holes or modifications to the PCB and, allow for easy rework of components with fast and easy installation and removal.

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Heatsink Push Pins

* Heatsink push pins provide a secure attachment method for heatsinks to your board with some PCB modifications. 

*  The heatsink push pin uses a spring that provides a constant and reliable pressure to ensure proper contact of the heatsink.

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Z clip with Pins

* Z clips are a wire formed heatsink clip , and attach heat sinks using pins mounted in the printed circuit board.

* Radian offers a wide range of wire form Z clips for optimal pressure, ensuring no damage to the PCB and ideal pressure of the heatsink to the component being cooled.

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Heatsink Captive Screws

* Captive screws provide a secure attachment method for our heatsinks to a PCB board.

* The screws provides a robust mechanical fastening that has been Shock, and vibration tested.

* It can be integrated with either aluminum or copper heatsinks.

* It's offer uniform compression with springs that compensate for any inconsistencies in the thermal pad thickness and the heat sink surface.

All of Radian products are RoHS-6 Compliant, as defined by EU Directive 2011/65/EC of the European Parliament and of the Council of June 8th 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment, unless otherwise requested.

RoHS Certificate of Compliance is available upon request.

Conflict Minerals

 

Radian will rely on industry initiatives, such as the Conflict Free Smelter Program, for assistance in complying with the SEC reporting requirements on conflict minerals.

We are committed to working with our suppliers to ensure effective implementation of this legislation.